Advanced Organics for Electronic Substrates and Packages - download pdf or read online

By A. Fletcher

ISBN-10: 1483133192

ISBN-13: 9781483133195

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In this approach, a thin metal or dielectric layer is deposited on the polyimide and patterned using a thin high resolution resist such as an e-beam resist, and the high aspect ratio pattern is transferred into the thick underlying polyimide layer. Polyimides are an ideal planarising material because they can be deposited over a wide range of thicknesses and are not degraded by high temperatures or chemicals involved in subsequent processing steps The high aspect ratio patterns formed in the polyimide can serve as masks for dry etching processes in which a relatively thick masking layer is required, or they can serve as a mask for ion implantation or ion-beam lithography.

Epoxies have such a large share of the market due to their reactivity with a variety of curing agents, which allow resin systems to be developed with a wide range of properties. The inherent strength of epoxies is high, with unfilled resins reaching between 12 000 and 14 000 psi in tension; epoxy-glass cloth can reach tensile strengths of 40 000 psi. The cure shrinkage of epoxy systems is low, which results in close tolerances in moulding. The low shrinkage has a further advantage in producing less residual stress in the cured part, giving longer term dimensional stability.

French producers found that profits 34 Advanced Organics in 1991 slumped by an average of 30% to 40% whilst prices were down by between 6% and 2 1 % . Reports from the Netherlands indicate that the production and consumption of engineering and high performance plastics in the Netherlands has remained unchanged for three years. It is estimated that the combined electrical and electronics industries account for 17% of the outlets for all types of new materials in European markets; automotive products account for 25%.

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Advanced Organics for Electronic Substrates and Packages by A. Fletcher


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